High frequency power amplifier module and wireless communication system

ABSTRACT

A high frequency power amplifier module of a multistage amplifier construction comprising: an input terminal; an output terminal; a control terminal; and a mode switching terminal. The first amplification stage includes a dual gate FET, and a bias voltage according to a signal is applied to the first gate and the second gate of the dual gate FET from the control terminal and the mode switching terminal, and a radio signal from the input terminal is applied to the second gate such as the source of the dual gate FET. In dependence upon the signal from the mode switching terminal, the mode of the high frequency power amplifier module is for the GSM (i.e., for a non-linear amplifying action) and for the EDGE (for a linear amplifying action).

This is a divisional application of U.S. Ser. No. 10/122,382 now U.S.Pat. No. 6,617,927, filed Apr. 16, 2002, which is a continuationapplication of U.S. Ser. No. 09/716,935, filed Nov. 22, 2000, now U.S.Pat. No. 6,433,639.

BACKGROUND OF THE INVENTION

The present invention relates to a high frequency power amplifier module(or a high frequency power amplifier) including a plurality ofamplification lines for linear amplifications and for non-linearamplifications (or saturated amplifications), and a wirelesscommunication system packaging the high frequency power amplifiermodule. More particularly, the invention relates to a techniqueeffective when applied to a multi-mode communication type cellularmobile phone having a plurality of communication functions of differentcommunication modes.

In North America, in recent years, there has been employed the so-called“dual mode mobile phone” in which there are incorporated into one mobilephone: the analog type AMPS (Advanced Mobile Phone Service) employed inthe prior art and covering the entire North America; and the digitalsystem such as the TDMA (Time Division Multiple Access) or the CDMA(Code Division Multiple Access).

In Europe and so on, on the other hand, there has been employed the GSM(Global system for Mobile Communication) system using the TDMA techniqueand the FDD (Frequency Division Duplex) technique. In the GSM system, onthe other hand, there has been developed the EDGE (Enhanced Data Ratesfor GSM Evolution) system as the communication system capable ofenhancing the transmission rate.

The multi-mode communications by the dual mode mobile phone or the likeare described, for example, on pp. 115 to 126 of “NIKKEI ELECTRONICS”(No. 681), issued by NIKKEI BP on Jan. 27, 1997.

Into the wireless communication system (or the mobile phone), there isincorporated an amplifier (or the high frequency power amplifier module)packaging transistors in multiple stages. The communication system isseriously influenced by the performance of the high frequency poweramplifier module.

In Japanese Patent Laid-Open No. 154321/1992, there is disclosed a highfrequency power amplifier which can control the high frequency outputpower over a wide range while retaining the satisfactory linearcharacteristics and the power efficiency stably. This high frequencypower amplifier has a multistage construction using a MOSFET (MetalOxide Semiconductor Field Effect Transistor) or a GaAs-FET in the finalstage circuit so that the high frequency output power is variablycontrolled by changing the bias condition of the drive circuit from theoutside while keeping the bias of the final stage circuit constant.There is also disclosed a technique for controlling the output power byincorporating a variable attenuator circuit into a high frequency inputline of the aforementioned circuit.

In Japanese Patent Laid-Open No. 26776/1999, on the other hand, there isdisclosed a power amplifier which can reduce the power consumptionwithout increasing the distortion and can improve the power efficiency.This power amplifier has a high frequency circuit employing a dual gateFET. This power amplifier is constructed such that two stages of dualgate FETs are cascade-connected between an input terminal In and anoutput terminal OUT. Specifically, the first gate on the drain side ofthe dual gate FET at the first stage is connected with the inputterminal IN, and the drain is connected with the first gate on the drainside of the dual gate FET at the final stage. The drain of the dual gateFET at the final stage is connected with the output terminal OUT. Thefirst gates of the first stage and the final stage are connected with afirst gate input terminal G1, and the second gates of the first stageand the final stage are connected with a second gate input terminal G2.

SUMMARY OF THE INVENTION

Most wireless data communications, as used in the mobile communications,are effected at a transmission rate of 9.6 Kbps. Since a highertransmission speed has been demanded for accessing to the internets ordata bases of enterprises, however, there has been needed acommunication system for the high speed. The GSM system servicing mainlyin Europe and Asia has the transmission rate of 9.6 Kbps at present. Inorder to satisfy the demands thus far described, however, there has beendeveloped the EDGE system having the high transmission rate. Byintroducing this system, the data transmission rate is raised to as highas 48 Kbps so that data of four times as high as that of the GSM systemcan be transmitted for a unit of time.

Another advantage of the EDGE system is that it can be run withoutintroducing any new infrastructure because it is practiced by using thebasic system of the GSM with a partial change in the wireless modulationmethod. This little change is attractive for many communicationbusinessmen.

For the modulation method, the GSM system adopts the GMSK (GaussianMinimum Shift Keying) modulation, but the EDGE system adopts the3π/8-rotating 8PSK (Phase Shift Keying) modulation. This means thechange from the GMSK modulation method to the 3π/8-rotating 8PSKmodulation method. For this change in the modulation method, the signaltransmission unit of the wireless communication system is required tohave a higher linearity.

Since the EDGE system is developed from the GSM system, one mobile phonecan desirably communicate with the GSM system and the EDGE system. Thismakes it necessary to incorporate both an amplifier for the GSM systemand an amplifier for the EDGE system in the mobile phone.

We have examined a high frequency power amplifier module which can coverboth the GSM system and the EDGE system with one amplifier and havefound out the following problems to be solved.

(1) The transistor acts, when employed in the GSM, in the saturatedstate so that a high power is demanded. For an input signal at about 0dBm, as modulated in the GMSK, an output power required is about 36 dBmat the maximum.

(2) The transistor acts, when employed in the EDGE, in the linear stateso that a linearity is demanded. For an input signal modulated at the3π/8-rotating 8 PSK, specifically, no distortion is required for theoutput signal. On the other hand, the maximum of the linear output poweris within a range of about 28 to 29 dBm.

(3) Since the GSM system and the EDGE system have a large difference inthe output power, as described above, it is questionable how to realizethe two system with the single amplifier. Specifically, the system formaking the non-linear action and the linear action compatible isexemplified by the AMPS (for the saturated action)/the CDMA (for thelinear action) of North America. In this case, the maximum output poweris about 30 to 32 dBm for the AMPS but about 28 to 29 dBm for the CDMA,so that the different is 2 to 3 dBm. Therefore, the compatible system iseasily enabled to match the two actions by making the input powervariable, even if it is operated at the same bias voltage. In theGSM/EDGE, however, the maximum power has a difference as large as 6 to 8dBm so that the two system cannot be made compatible with one circuit.

(4) The mobile phone is powered by the battery so that it is required toa higher efficiency for a longer use. For example, the GSM is requiredto have an efficiency of about 50 to 60%, and the EDGE is required tohave an efficiency of about 35 to 40%. This makes it desirable to makethe used power amplification element as small as possible.

An object of the invention is to provide a high frequency poweramplifier module and a wireless communication system for making the GSMsystem (for the saturated action) and the EDGE system (for the linearaction) compatible in one circuit.

Another object of the invention is provide a high frequency poweramplifier module and a wireless communication system, which can improvethe AM modulation (or the AM—AM conversion).

Still another object of the invention is to provide a high frequencypower amplifier module and a wireless communication system, which caneasily isolate input and output terminals while causing little signalleakage.

The foregoing and other objects and novel features of the invention willbecome apparent from the description to be made with reference to theaccompanying drawings.

The representative of the invention to be disclosed herein will bebriefly summarized in the following.

(1) According to an aspect of the invention, there is provided a highfrequency power amplifier module having a multistage amplifierconstruction, in which a plurality of semiconductor amplificationelements are sequentially cascade-connected. The high frequency poweramplifier module includes at least an input terminal, an outputterminal, a control terminal and a mode switching terminal as itsexternal terminals. The amplification element at the first stage isexemplified by a dual gate FET, which is fed at a first gate G₁ close toits drain with a signal from the control terminal and at a second gateG₂ with a radio signal from the input terminal. To the second gate G₂,on the other hand, there is applied a bias voltage which is based on thesignal from the control terminal and a signal from the mode switchingterminal. In accordance with the signal from the mode switchingterminal, the high frequency power amplifier module is caused to act asan amplifying line for the GSM or an amplifying line for the EDGE. Inthis case, the amplifying line for the GSM system acts non-linearly sothat its output power is about 36 dBm at

The representative of the invention to be disclosed herein will bebriefly summarized in the following.

(1) According to an aspect of the invention, there is provided a highfrequency power amplifier module having a multistage amplifierconstruction, in which a plurality of semiconductor amplificationelements are sequentially cascade-connected. The high frequency poweramplifier module includes at least an input terminal, an outputterminal, a control terminal and a mode switching terminal as itsexternal terminals. The amplification element at the first stage isexemplified by a dual gate FET, which is fed at a first gate G¹ close toits drain with a signal from the control terminal and at a second gateG² with a radio signal from the input terminal. To the second gate G²,on the other hand, there is applied a bias voltage which is based on thesignal from the control terminal and a signal from the mode switchingterminal. In accordance with the frequency power amplifier module iscaused to act as an amplifying line for the GSM or an amplifying linefor the EDGE. In this case, the amplifying line for the GSM system actsnon-linearly so that its output power is about 36 dBm at the maximum,and the amplifying line for the EDGE system acts linearly so that itsoutput power is about 29 dBm at the maximum.

According to this means:

-   -   (a) the GSM system (for the saturated action) and the EDGE        system (for the linear action) can be realized in the common        circuit; and    -   (b) in the high frequency power amplifier module of the        multistage amplifier construction, the input stage (or the first        stage) is constructed to include a dual gate FET which is fed at        its first gate with a control voltage. As seen from a graph of        FIG. 3, therefore, the AM—AM conversion (AMout) can be improved        to 16% or less for an input power Pin of 6 dBm or higher.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a circuit diagram of a high frequency power amplifier moduleaccording to one embodiment (or Embodiment 1) of the invention;

FIG. 2 is a graph illustrating correlations between an external controlvoltage and a gate voltage in the high frequency power amplifier modulepackaging a dual gate FET according to Embodiment 1;

FIG. 3 is a graph plotting an AM modulation by the high frequency poweramplifier module of Embodiment 1;

FIG. 4 is a sectional view showing a sectional structure of a portion ofthe dual gate FET packaged in the high frequency power amplifier moduleof Embodiment 1;

FIG. 5 is a circuit diagram schematically showing the high frequencypower amplifier module of one embodiment of the invention;

FIG. 6 is a block diagram schematically showing a construction of awireless communication system packaging the high frequency poweramplifier module of the embodiment;

FIG. 7 is a graph plotting isolation characteristics betweeninput/output terminals in the high frequency power amplifier moduleaccording to another embodiment (or Embodiment 2) of the invention;

FIG. 8 is a circuit diagram of a high frequency power amplifier moduleaccording to another embodiment (or Embodiment 3) of the invention;

FIG. 9 is a graph illustrating correlations between an external controlvoltage and a gate voltage in a high frequency power amplifier modulepackaging a dual gate FET of Embodiment 3;

FIG. 10 is a circuit diagram of a high frequency power amplifier moduleaccording to another embodiment (or Embodiment 4) of the invention;

FIG. 11 is a graph illustrating correlations between an external controlvoltage and a gate voltage in a high frequency power amplifier modulepackaging a dual gate FET of Embodiment 4.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

The invention will be described in detail in connection with itsembodiments with reference to the accompanying drawings. Throughout allthe drawings for explaining the embodiments of the invention, thecomponents having identical functions will be designated by the commonreference numerals, and their repeated description will be omitted.

(Embodiment 1)

FIG. 1 is a circuit diagram of a high frequency power amplifier module(or a high frequency power amplifier) according to one embodiment (orEmbodiment 1) of the invention. Embodiment 1 will be described on thecase in which a semiconductor amplification element (or transistor) isexemplified by a dual gate field effect transistor (or dual gate FET).

A high frequency power amplifier module 1 of Embodiment 1 is provided asits external electric terminals with: an input terminal 2 to be fed withan input signal Pin (i.e., a signal to be amplified); an output terminal3 for outputting an output signal Pout; a first voltage terminal 4 fixedat a first reference potential Vdd; a not-shown second voltage terminalfixed at a second reference potential Vss (e.g., at the ground); and acontrol terminal 6 to which a variable voltage Vapc is applied.

The high frequency power amplifier module 1 has a single stage amplifierconstruction for amplifications with one semiconductor amplificationelement (or transistor) or a multistage amplifier construction forindividual amplifications with a plurality of transistors which aresequentially cascade-connected. Embodiment 1 will be described on thehigh frequency power amplifier module of the single stage constructionin which the dual gate FET is packaged as the transistor.

A transistor T1, i.e., a dual gate FET 7 is connected at its second gateG₂ with the input terminal 2 through a microstrip line MS1. A capacitorC1 is connected in series between the microstrip line MS1 and the inputterminal 2, and a capacitor C3 is connected in parallel between themicrostrip line MS1 and the ground (i.e., the second reference potentialVss).

Between a node b between a resistor R1 and the control terminal 6 and afirst gate G₁ of the dual gate FET 7, on the other hand, there isconnected in series a resistor R5 for setting the potential to beapplied to the first gate G₁.

With the second gate G₂ of the dual gate FET 7, on the other hand, thereare connected two resistors R1 and R2, of which the lower potentialresistor R2 is connected with the ground whereas the higher potentialresistor R1 is connected with the control terminal 6, thereby toconstruct a resistance-type potential dividing circuit (or a breedercircuit) Between a node a between the two resistors R1 and R2 and thesecond gate G₂, on the other hand, there is connected a resistor R3 forsetting a potential to be applied to the second gate G₂. This resistorR3 is effective for suppressing such an impedance on the side of theresistance-type potential dividing circuit as will influence the secondgate G₂.

On the other hand, a drain terminal D or the first terminal of the dualgate FET 7 is connected with the first voltage terminal 4 throughmicrostrip lines MS3 and MS2 and with the output terminal 3 through amicrostrip line MS4 and a capacitor C2. To the first voltage terminal 4,there is applied the first reference potential Vdd as the power voltage.On the other hand, the second terminal of the dual gate FET 7 acts as asource terminal S and is connected with the ground potential (or thesecond reference potential Vss). Moreover, a capacitor C4 is connectedbetween the microstrip line MS4 and the ground, although not especiallylimitative thereto.

Here will be briefly described the construction of the dual gate FET 7with reference to FIG. 4.

The dual gate FET 7 is made of either a compound semiconductor such asGaAs or Si (silicon) and will be described in Embodiment 1 on the casein which it is exemplified by a Si-MOSFET. FIG. 4 is a sectional viewshowing a cell portion of the dual gate FET 7, which is fabricated bydoping a P-type epitaxial layer 21, as formed over on face (or upperface) of a substrate 20 of Si, selectively with predetermined impurityatoms to form an N-type (e.g., N⁺-type or N⁻-type) or P-type (e.g.,P⁺-type) semiconductor region.

Specifically, a P-type well 22 is selectively formed in the surfacelayer portion of the epitaxial layer 21, and N⁻-type regions 23 areformed individually in the P-type well 22 and in the region from theP-type well 22 and outside of the P-type well 22. In FIG. 4, threeN⁻-type regions 23 a, 23 b and 23 c are arranged from left to right. TheN⁻-type region 23 c at the righthand end extends at its lefthand endportion into the P-type well 22. In the surface layer portions of theN⁻-type regions 23 a, 23 b and 23 c, there are formed N⁺-type regions 24(as indicated by 24 a, 24 b and 24 c from left to right) in the regionor at or slightly over one end of the region.

The surface layer portions of the P-type region between the N⁺-typeregion 24 a and the and N⁻-region 23 b and between the region N⁺-typeregion 24 b and the N⁻-type region 23 c provide channels, over whichthere is individually formed gate insulating film 25 which is overlaidby a first gate electrode 26 or a second gate electrode 27.

At the lefthand end portion, on the other hand, there are formed aP⁺-type region 28 depthwise extending through the epitaxial layer 21 tothe surface layer portion of the substrate 20, and a P⁺-type region 29depthwise extending to the surface layer portion of the P-type well 22.Of these, the P⁺-type region 28 is formed on the lefthand side frommidway of the N⁺-type region 24 a at the lefthand end portion, and theP⁺-type region 29 is so formed on the lefthand side from the lefthandend portion of the N⁺-type region 24 a as to overlie the N⁻-type region23.

On the other hand, the epitaxial layer 21 (or the substrate 20) iscovered on its surface with an insulating film forming the gateinsulating film 25 and a layer insulating film 30 formed over the formerinsulating film. This layer insulating film 30 covers the first gateelectrode 26 and the second gate electrode 27, too.

In the layer insulating film 30 over the N⁺-type regions 24 a and 24 cand the P⁺-type region 29, there are formed contact holes, and theelectrodes are selectively disposed over the contact holes and the layerinsulating film 30. Of these, the electrode over the N⁺-type region 24 cprovides a drain electrode 31, and both the electrodes over the N⁺-typeregion 24 a and the P⁺-type region 29 are connected over the layerinsulating film 30 to provide a source electrode 32. Therefore, thefirst gate electrode 26 is closer to the drain whereas the second gateelectrode 27 is closer to the source.

Here, the semiconductor chip thus provided with the dual gate FET 7 isfurther provided with a resistor and/a capacitor, if necessary. Alsoprovided is a transistor for constructing a current mirror circuit, aswill be described hereinafter.

For such dual gate FET 7, a bias voltage is generated by the resistorsR1, R2, R3, R5 and so on. This bias voltage has characteristics, asillustrated in FIG. 2.

FIG. 2 is a graph illustrating correlations between a control voltage(e.g., the external control voltage) Vapc and a gate voltage (e.g., thevoltage at the first gate G₁ or the voltage at the second second gateG₂). Letters Vg1 designate the voltage characteristics of the first gateG₁, and letters Vg2 designate the voltage characteristics of the secondgate G₂. Both of these characteristics exhibit a linearity, thegradients of which are steeper at the voltage characteristics Vg1 thanat the voltage characteristics Vg2. In the graph, a control voltage V₁and a first gate G₁ voltage V₃ are set to equal levels such as about 2to 2.5 V. When the control voltage Vapc is at the level V₁, moreover, avoltage V₂ to be applied to the second gate G₂ is set to about one halfof the level V₃.

Therefore, the FET to act at the first gate closer to the drain of thedual gate FET acts (ON) faster than the FET to act at the second gatecloser to the source of the dual gate FET but does not act (OFF) laterthan the FET to act at the second gate closer to the source. As aresult, it is possible to reduce the noise in the OFF state. On theother hand, the change in a mutual conductance g_(m) of the FET to actat the first gate is larger than that of the FET to act at the secondgate. In other words, there is achieved an effect that the gain controlrange is widened.

The high frequency power amplifier module 1 of Embodiment 1 isconstructed such that the control voltage Vapc is fed to the first gateG₁ of the dual gate FET 7. When the system is OFF, therefore, no voltageis applied to the first gate G₁ so that the second gate G₂ and the draincan be electrically isolated to reduce the leakage (or noise)transmission of the input power from the second gate G₂ to the drain.This circuit construction can also be employed in the GSM system ofnon-linear actions (for the saturated actions) or the EDGE system oflinear actions to achieve the noise reduction in the system OFF state.

The high frequency power amplifier module 1 of Embodiment 1 has aneffect for improving the AM—AM conversion. FIG. 3 is a graph plottingthe AM—AM conversion characteristics. The abscissa indicates the powerPin (in dBm) of the input signal Pin, and the ordinate indicates anAMout (or the AM—AM conversion). In the case of the single gate, theoutput power at the measuring time is controlled to a constant value,but the voltage Vapc has a tendency to be lowered as the input powerincreases. As exemplified by the single gate MOSFET, therefore, theAM—AM conversion (AMout) grows the higher (or the worse) as the inputpower increases. The reduction in the voltage Vapc implies the reductionin the gate bias voltage of the single gate MOSFET. When the gate biasvoltage is lowered, the MOSFET does the amplification in the non-linearregion near the threshold voltage so that the output waveform isdistorted to have a worse AM distortion.

Even in case the dual gate MOSFET is employed as in Embodiment 1 (ofFIG. 1), on the contrary, the AMout is improved, as shown in FIG. 3.This is an example of the comparison between the case of the servicefrequency band of 880 MHz of the GSM and the case of 915 MHz. In thedual gate MOSFET, a relatively high bias voltage is applied to the gateof the drain side MOSFET so as to prevent the power voltage to beapplied to the source side MOSFET from drastically dropping. In short,there is applied a higher gate bias voltage than that of the single gateMOSFET. Therefore, the gate bias voltage is set to a higher level thanthe threshold voltage of the drain side MOSFET so that theamplifications are performed in a more linear region to reduce thedistortion of the output. As a result, the AM distortion is improved. Inother words, the single gate MOSFET operates in a state approximate theclass “C” amplifier. In the dual gate MOSFET, for an equal output power,the balance between the power voltage and the gate bias voltage can bechanged to a state approximate the class “A” amplifier, thereby toreduce the distortion of the waveform.

Here, the AM—AM conversion characteristics indicate the distortion whichis made at the output side when an amplitude-modulated signal issuperposed on the carrier wave.

As the effects for the AM—AM conversion, on the other hand, similarimprovements and effects can also be expected, in the case of themultistage amplifications of the circuit of FIG. 1: when used (1) at theinput stage (or the first stage) in the two-stage amplifier; (2) at theinput stage or the drive stage (or the second stage) of a three-stageamplifier; and (3) at the input stage and the drive stage of thethree-stage amplifier.

Embodiment 1 has been described on the high frequency power amplifiermodule which packages the single semiconductor amplification element,but the invention could also be applied to the high frequency poweramplifier module of the multistage amplifier construction in which theplurality of semiconductor amplification elements are sequentiallycascade-connected, as has been described hereinbefore.

As a more specific embodiment of the invention, here will be describedwith reference to FIGS. 5 and 6 a high frequency power amplifier moduleof a three-stage amplifier construction which can perform theamplifications of the GSM system and the EDGE system by switching themodes. FIG. 5 is a circuit diagram of the high frequency power amplifiermodule of Embodiment 1, and FIG. 6 is a block diagram showing aconstruction of a wireless communication system (or a mobile phone)packaging the high frequency power amplifier module of Embodiment 1.

The high frequency power amplifier module 1 of this embodiment isconstructed, as shown in FIG. 5, to have three stage amplifications, ofwhich the first stage (or the input stage) uses the transistor T1 havingthe dual gate FET structure whereas the second stage (or the drivestage) and the third stage (or the final stage: the output stage) use asingle gate Si-MOSFETs (i.e., transistors T2 and T3).

The transistors T1, T2 and T3 are sequentially cascade-connected betweenthe input terminal 2 and the output terminal 3, and matching circuits M1to M4 are interposed between the individual stages. On the other hand,the drain terminals D of the individual transistors T1, T2 and T3 areconnected through microstrip lines MS2, MS4 and MS5 and coils L2, L3 andL4 with the first voltage terminal 4 to be fed with the first referencepotential Vdd. Between the first voltage terminal 4 and the individualcoils L2, L3 and L4, on the other hand, there are connected in parallelcapacitors C5 to C7 which are connected at their one-end electrodes withthe ground. Here, the coils may be parasitic.

On the other hand, each stage is provided with a bias circuit, a currentmirror circuit for temperature compensations, and a mode switchingcircuit for switching the modes of the GSM system and the EDGE system.In order to construct the current mirror circuit: a current mirrorcircuit transistor T_(CM) 1 of the dual gate FET construction ismonolithically formed in the semiconductor chip to be used at the firststage; a current mirror circuit transistor T_(CM) 2 of the single gateFET construction is monolithically formed in the semiconductor chip tobe used at the second stage; and a current mirror circuit transistorT_(CM) 3 of the single gate FET construction is monolithically formed inthe semiconductor chip to be used at the third stage.

The mode switching circuit is provided with mode switching transistors(MOSFETs) T_(SW) 1 to T_(SW) 3 which are connected at their gateelectrodes with a mode switching terminal 9 through resistors R4, R9 andR13, respectively.

The bias circuit is constructed to include individually three sets ofresistors (R1 to R3, R6 to R8, and R10 to R12) which are connected attheir one-end terminals with nodes a, c and d, respectively. The firsttransistors R1, R6 and R10 are connected with the control terminal 6;the second transistors R3, R8 and R12 are connected with the gateelectrodes G of the transistors T1, T2 and T3 (e.g., the second gate G₂of the transistor T1); and the third resistors R2, R7 and R11 areconnected with the drains of the mode switching transistors T_(SW) 1 toT_(SW) 3 and the gates G of the current mirror circuit transistorsT_(CM) 1 to T_(CM) 3 (e.g., the second gate G₂ of the transistor T_(CM)1).

The drains of the current mirror circuit transistors T_(CM) 1 to T_(CM)3 are connected with the nodes a, c and d and further with the gates Gof the transistors T_(CM) 1 to T_(CM) 3 (e.g., the second gate G₂ of thetransistor T_(CM) 1) through the resistors R2, R7 and R11. On the otherhand, the mode switching transistors T_(SW) 1 to T_(SW) 3 and thecurrent mirror circuit transistors T_(CM) 1 to T_(CM) 3 are grounded attheir sources to the earth.

At the first stage, on the other hand, the control terminal 6 isconnected through the resistor R5 with the individual first gates G₁ ofthe transistor T1 and the current mirror circuit transistor T_(CM) 1.

The high frequency power amplifier module 1 thus constructed is packagedin the cellular mobile phone (or the wireless communication system), asshown in FIG. 6. In FIG. 6: the first stage, as constructed of the dualgate FET 7 or the like of the high frequency power amplifier module 1,is an amplifier A1; the second state is an amplifier A2; and the thirdstage is an amplifier A3, of which the amplifier A1 is partially shownin the same state as that of FIG. 1.

In the mobile phone, the input terminal 2 of the high frequency poweramplifier module 1 is connected with a radio signal generator 11. Thisradio signal generator 11 receives a voice or a data signal, andconverts it and outputs a high frequency signal. This output signal isfed as the input signal Pin to the input terminal 2.

The control signal (or the APC signal) is processed by a variable biascircuit 12, the output of which is fed as the control voltage signalVapc to the control terminal 6.

The mobile phone is operated, each time it is used, with its select keysto select either the GSM system or the EDGE system. Specifically, themode switching signal, the state of which is determined by the operationof the select keys, is fed to a mode switching circuit 13 to turn ON/OFFa switch 14. Thus, the mode switching circuit 13 generates a modeswitching signal voltage according to the operation of the select keys,so that the mode switching signal voltage is fed to the mode switchingterminal 9. The mode switching transistors T_(SW) 1 to T_(SW) 3 arecontrolled by that mode switching signal.

The high frequency power amplifier module 1 is connected at its outputterminal 3 with a transmission/reception change-over switch 15. Withthis transmission/reception change-over switch 15, there is connectednot only a receiving circuit 16 but also an antenna 17.

On the other hand, the output power, as outputted from the outputterminal 3, is detected by a detector 18. The detection result of thisdetector 18 is fed to a not-shown APC circuit, from which theaforementioned APC signal is outputted.

Here will be described the GSM mode and the EDGE mode with reference toFIGS. 6 and 5.

In the GSM mode, the mode switching circuit 13 is turned ON so that avoltage exceeding a constant level is applied to the mode switchingterminal 9. When the voltage exceeding the constant level is applied tothe mode switching terminal 9, the mode switching transistor T_(SW) 1 isbiased at its gate so that it is turned ON. When the mode switchingtransistor T_(SW) 1 is turned ON, the resistance of (R1+R2) overcomesthe ON resistance of the mode switching transistor T_(SW) 1 sufficientlyso that the potential of a node e becomes substantially equal to theground potential. Therefore, the current mirror circuit transistorT_(CM) 1 is in the off state. As a result, a current I₂ does not flowbetween the drain and source of the current mirror circuit transistorT_(CM) 1. At this time, a bias current I₁ is caused to flow by thevoltage applied from the variable bias circuit 12 so that the voltage atthe node a, as divided by the resistor R1 and the resistor R2, isapplied to the second gate G₂ of the dual gate FET 7 composing the firststage transistor T1.

In the GSM mode, the output powers of the second and third stageamplifiers A2 and A3 are also controlled as at the first stage by thevoltage which is generated by the variable bias circuit 12. In the GSMmode, the power amplifier module is employed in the non-linear action sothat the maximum output power is about 35 dBm.

In the EDGE mode, the mode switching circuit 13 is turned OFF so that avoltage at a constant (about 0 V) or lower level is applied to the modeswitching terminal 9. As a result, the mode switching transistor T_(SW)1 is biased at its gate with substantially 0 V so that it is turned OFF.In the EDGE mode, on the other hand, the bias voltage, as generated bythe variable bias circuit 12, is fixed at an arbitrary value (for whicha plurality of values may be prepared and changed for the situations).In this case, the output power Pout is controlled by changing themagnitude of an input signal RFin (or Pin). Upstream of the inputterminal 2, more specifically, there is provided a gain control circuit,by which the magnitude of the input signal Pin is changed to change themagnitude of the output power Pout.

When the mode switching transistor T_(SW) 1 is turned OFF, no currentflows between the node a (at the potential of the second gate G₂ of thecurrent mirror circuit transistor T_(CM) 1) and the node e (at thepotential of the drain of the mode switching transistor T_(SW) 1) sothat the node a and the node e take the same potential.

In the state where an arbitrary voltage for the EDGE actions is appliedfrom the variable bias circuit 12, a predetermined bias is applied toboth the first gate G₁ and the second gate G₂ of the current mirrorcircuit transistor T_(CM) 1. As a result, the current mirror circuittransistor T_(CM) 1 is ON. At this time, the bias current I₂ is causedto flow by the voltage applied from the variable bias circuit 12. Sincethe second gate G₂ and the drain of the current mirror circuittransistor T_(CM) 1 are at the same potential, the current mirrorcircuit transistor T_(CM) 1 acts to set the current I₂ to a constantlevel so long as the voltage from the variable bias circuit 12 does notchange. In this embodiment, on the other hand, the dual gate FET 7 andthe current mirror circuit transistor T_(CM) 1 are fabricated with thesame structure in the common semiconductor chip but have different gatewidths (that is, the current mirror circuit transistor T_(CM) 1 is givena size as large as one N-th of the dual gate FET 7 (i.e., the transistorT1), where N is a real number). The current mirror circuit transistorT_(CM) 1 and the dual gate FET 7 construct the current mirror circuit toperform the current mirror action. In this case, the node e, the node aand the second gate G₂ of the transistor T1 (or the dual gate FET 7) areat the same potential. As a result, the current mirror is establishedbetween the current I₂ to flow through the control voltage signal: Vapc,the resistor R1 and the current mirror circuit transistor T_(CM) 1, andthe electric current to flow through the power voltage Vdd, the coil L2,the microstrip line MS2 and the dual gate transistor T1. The current I₂is determined by the characteristics of the control voltage signal Vapc,the resistor R1 and the transistor T_(CM) 1. In case the gate has thewidth N, an idle current as high as N times of the current I₂ flowsbetween the drain and source of the dual gate FET 7 (i.e., thetransistor. T1).

In the EDGE mode, the linear action is made to provide the maximumoutput power of about 29 dBm. Since the EDGE mode is linear, it is notdesired to change the output power by changing the bias voltage.Therefore, the control voltage signal Vapc takes a constant value sothat the amplitude of the input signal Pin to be fed to the inputterminal 2 is controlled to set the output power to a desired value.This control is performed by an AGC using an attenuator to be connectedwith the input terminal 2.

In addition to the effects of Embodiment 1, according to thisembodiment, the gradient (or slope) of the increase in the output powerper unit bias voltage applied to the control terminal 6 becomes gentleto improve the controllability of the power control. Therefore, it ispossible to control the output power to a low power level. Moreover, theoutput power is easily controlled from the outside.

(Embodiment 2)

FIG. 7 is a graph plotting isolation characteristics betweeninput/output terminals in the high frequency power amplifier moduleaccording to another embodiment (or Embodiment 2) of the invention.

In Embodiment 2, although not especially presented in a circuit diagram,the high frequency power amplifier module has a two-stage amplifyingconstruction of a first stage (or an input stage) and a second stage, ofwhich the first stage is constructed to include the dual gate FET 7 asin Embodiment 1 whereas the second stage is constructed to include asingle gate Si-MOSFET. In other words, the first stage acts as a drivestage for the single gate Si-MOSFET or the output stage.

As compared with the three-stage amplifier, the two-stage amplifier islowered in the isolation characteristics in which the input power leaksfrom the output terminal, but this isolation can be improved, as shownin FIG. 7, by using the dual gate FET as the driver stage of thetwo-stage amplifier.

Generally, the two-stage construction of the amplifier is lower in thegain than the three-stage construction so that a higher input power isneeded for the same output power. Especially in the GSM mode, the outputpower of the output stage transistor is controlled for a constant inputpower with the voltage which is generated by the variable bias circuit.By using the single gate MOSFET as in the prior art, the aforementionedinput power is increased to raise the gate potential of the input stagetransistor of the amplifier. As a result, an input signal at a certainvalue or higher enters even if the gate bias of the input stagetransistor is set to 0 V. When this input signal exceeds a thresholdvoltage V_(th) of the input stage transistor, this input stagetransistor is turned ON by forming its channel. When the high frequencypower amplifier module is adopted in the mobile phone, the power switchor the like is not employed for lowering the power voltage and forreducing the current consumption, but the high frequency power amplifiermodule is often connected directly with the power source so that itreceives the power voltage at all times. As a result, the input signalwill leak to the output side.

When the dual gate FET is employed, on the other hand, no channel isformed for the first gate G₁ of the dual gate FET to apply no voltage tothe drain on the side of the second gate G₂, if the voltage of thevariable bias circuit is lowered over the threshold voltage V_(th). Evenwhen a high input signal is inputted to the second gate G₂ to exceed thethreshold voltage V_(th), therefore, no channel is formed for the secondgate G₂. As a result, it is possible to suppress the leakage power.Therefore, the leakage power after the improvement can be made as smallas the leakage due to the coupling by the parasitic capacity or thelike.

The circuit can be simplified because the input/output terminals can beeasily isolated. Therefore, it is possible to reduce the size of thehigh frequency power amplifier module 1 and accordingly the size of thewireless communication system.

Here, the AM—AM conversion can also be improved by using the dual gateFET in the driver stage of the two-stage amplifier construction.

(Embodiment 3)

FIG. 8 is a circuit diagram of a high frequency power amplifier moduleaccording to another embodiment (or Embodiment 3) of the invention, andFIG. 9 is a graph illustrating correlations between an external controlvoltage in a high frequency power amplifier module and a gate voltage ofthe MOSFET 7.

In the circuit of Embodiment 1, according to Embodiment 3, a diode D1 isconnected in series between the node b connected with the controlterminal 6 and the resistor R5, and a resistor R14, as connected at itsone electrode with the ground, is connected at its other electrodebetween the first gate G₁ of the dual gate FET 7 and the resistor R5. Bypackaging that diode D1, as shown in FIG. 9, the rise of the potentialin the first gate G₁ of the dual gate FET 7 shifts from 0 to a plusvoltage (or an offset voltage). As a result, the isolation effect whenthe voltage Vapc is set to 0 V can set the potential Vg1 of the gate G₁to the ground potential even if a residual voltage (e.g., about 0.2 to0.5 V) is in the voltage Vapc so that the effect can be more reliablyattained than the cases of Embodiment 1 and Embodiment 2.

Here, the circuit can be employed in both the single-stage amplifierconstruction and the multistage amplifier construction.

(Embodiment 4)

FIG. 10 is a circuit diagram of a high frequency power amplifier moduleaccording to another embodiment (or Embodiment 4) of the invention, andFIG. 11 is a graph illustrating correlations between an external controlvoltage in a high frequency power amplifier module and a gate voltage ofthe MOSFET 7.

In Embodiment 4, the control voltage is generated by a voltage dividerwhich is connected between the first gate G₁ of the first stage dualgate FET 7 and the control terminal 6 and which is constructed toinclude resistors R15 to R17. This control voltage is the output, i.e.,a control voltage Vagc of the not-shown AGC (Auto Gain Control) circuit.

The gate G₂ of the first stage dual gate FET 7 is fed as in Embodiment 1with the input signal Pin from the input terminal 2 and a controlvoltage Vg from the gate control terminal 10. A bias voltage is appliedto the gates of the transistors T1, T2 and T3 (e.g., to the second gateG₂ in the transistor T1) by a bias circuit which has first, second andthird stages constructed to include three resistors (R18 to R20, R21 toR23, and R24 to R26), respectively.

In Embodiment 4, the correlations between the external control voltageand the gate voltage are illustrated in FIG. 11. In Embodiment 4, thesecond gate G₂ is set to a constant potential. As a result, the outputpower and the gain can be controlled with the change in the appliedvoltage to the gate G₁, and the fluctuation of the input impedance ofthe gate G₂ at the output power control time can be suppressed. Thus,there is obtained an effect for suppressing the affections on the radiosignal generator on the input side.

According to Embodiment 4, on the other hand, it is possible toincorporate the function (i.e., the control function by the AGC circuit)which has to be added in the prior art from the outside.

Although our invention has been specifically described on the basis ofits embodiments, it should not be limited to the embodiments but couldnaturally be modified in various manners without departing from the gistthereof. For example, the semiconductor amplification element can belikewise applied with similar effects even if it is made of a compoundsemiconductor of GaAs or the like. On the other hand, the dual gate FETcould also be constructed by preparing two transistors corresponding tothe gate G₁ and the gate G₂ and by connecting the two transistors in amanner to have a series connection in their drain-source paths.

The effects to be obtained from the representative of the inventions, asdisclosed herein, will be briefly described in the following.

It is possible to provide a high frequency power amplifier module, inwhich the GSM system (for the saturated actions) and the EDGE system(for the linear actions) are compatible in the common circuit, and awireless communication system.

It is possible to provide a high frequency power amplifier modulecapable of improving the AM—AM conversion, and a wireless communicationsystem.

It is possible to provide a high frequency power amplifier module whichfinds it easy to isolate the input/output terminals and it hard to causethe signal leakage, and a wireless communication system.

Because the input/output terminals can be easily isolated, the circuitcan be simplified to provide a small-sized high frequency poweramplifier module and a small-sized wireless communication system.

It is possible to provide a high frequency power amplifier module whichcan be easily power-controlled.

1. A high frequency power amplifier module comprising: an inputterminal; an output terminal; a control terminal; a mode switchingterminal; a semiconductor amplification element including a first gateand a second gate between a drain and a source, said first gate beingcloser to said drain for receiving the signal from said controlterminal, and said second gate being closer to said source for receivingthe signal from said input terminal; a circuit for supplying said outputterminal with a signal responding to the signal outputted from the drainof said semiconductor amplification element; a bias circuit coupled withsaid control terminal for supplying the second gate of saidsemiconductor amplification element with a bias responding to a controlvoltage supplied to said control terminal; and a mode switching circuitoperated in response to the signal from said mode switching terminal tosupply an output signal to the second gate of said semiconductoramplification element.
 2. A high frequency power amplifier moduleaccording to claim 1, wherein said circuit disposed between saidsemiconductor amplification element and said output circuit includes oneor more cascade-coupled second semiconductor amplification elements, andwherein said second semiconductor amplification element includes: acontrol terminal coupled with the output terminal of the upstream stagesemiconductor amplification element; and a first terminal coupled witheither said output terminal or the downstream stage semiconductoramplification element.
 3. A high frequency power amplifier moduleaccording to claim 2, further comprising: an AGC (auto gain contol)circuit for supplying its output to the first gate of said semiconductoramplification element.
 4. A high frequency power amplifier moduleaccording to claim 1, wherein said high frequency power amplifier moduleis an amplifier system for the GSM (global system for mobilecommunication), when the output signal of said mode switching circuitexhibits a first state, and an amplifier system for the EDGE (enhanceddata rates for GSM evolution) when the output signal of said modeswitching circuit exhibits a second state.
 5. A high frequency poweramplifier module comprising: an input terminal; an output terminal; acontrol terminal; a mode switching terminal; a semiconductoramplification element including a first gate and a second gate between adrain and a source, said first gate being closer to said drain forreceiving the signal from said control terminal, and said second gatebeing closer to said source for receiving the signal from said inputterminal; a circuit for supplying said output terminal with a signalresponding to the signal outputted from the drain of said semiconductoramplification element; a bias circuit coupled with said control terminalfor supplying the first gate and the second gate of said semiconductoramplification element with a bias responding to a control voltagesupplied to said control terminal; and a mode switching circuit operatedin response to the signal from said mode switching terminal to supply anoutput signal to the second gate of said semiconductor amplificationelement.
 6. A high frequency power amplifier module according to claim5, wherein said high frequency power amplifier module is an amplifiersystem for the GSM (global system for mobile communication), when theoutput signal of said mode switching circuit exhibits a first state, andan amplifier system for the EDGE (enhanced data rates for GSM evolution)when the output signal of said mode switching circuit exhibits a secondstate.
 7. A wireless communication system comprising a high frequencypower amplifier module at the output stage on a transmission side,wherein said high frequency power amplifier module includes: an inputterminal; an output terminal; a control terminal; a mode switchingterminal; a semiconductor amplification element including a first gateand a second gate between a drain and a source, said first gate beingcloser to said drain for receiving the signal from said controlterminal, and said second gate being closer to said source for receivingthe signal from said input terminal; a circuit for supplying said outputterminal with a signal responding to the signal outputted from the drainof said semiconductor amplification element; a bias circuit coupled withsaid control terminal for supplying the second gate of saidsemiconductor amplification element with a bias responding to a controlvoltage supplied to said control terminal; and a mode switching circuitoperated in response to the signal from said mode switching terminal tosupply an output signal to the second gate of said semiconductoramplification element.
 8. A wireless communication system according toclaim 7, wherein said circuit disposed between said semiconductoramplification element and said output circuit includes one or morecascade-coupled second semiconductor amplification elements, and whereinsaid second semiconductor amplification element includes: a controlterminal coupled with the output terminal of the upstream stagesemiconductor amplification element; and a first terminal coupled witheither said output terminal or the downstream stage semiconductoramplification element.
 9. A wireless communication system according toclaim 8, further comprising: an AGC (auto gain control) circuit forsupplying its output to the first gate of said semiconductoramplification element.
 10. A wireless communication system according toclaim 7, wherein said high frequency power amplifier module acts as anamplification module for the GSM (global system for mobilecommunication), when the output signal of said mode switching circuitexhibits a first state, and an amplification module for the EDGE(enhanced data rates for GSM evolution) when the output signal of saidmode switching circuit exhibits a second state.
 11. A wirelesscommunication system comprising a high frequency power amplifier moduleat the output stage on a transmission side, wherein said high frequencypower amplifier module includes: an input terminal; an output terminal;a control terminal; a mode switching terminal; a semiconductoramplification element including a first gate and a second gate between adrain and a source, said first gate being closer to said drain forreceiving the signal from said control terminal, and said second gatebeing closer to said source for receiving the signal from said inputterminal; a circuit for supplying said output terminal with a signalresponding to the signal outputted from the drain of said semiconductoramplification element; a bias circuit coupled with said control terminalfor supplying the first gate and the second gate of said semiconductoramplification element with a bias responding to a control voltagesupplied to said control terminal; and a mode switching circuit operatedin response to the signal from said mode switching terminal to supply anoutput signal to the second gate of said semiconductor amplificationelement.
 12. A wireless communication system according to claim 11,wherein said high frequency power amplifier module acts as anamplification module for the GSM (global system for mobilecommunication), when the output signal of said mode switching circuitexhibits a first state, and an amplification module for the EDGE(enhanced data rates for GSM evolution), when the output signal of saidmode switching circuit exhibits a second state.
 13. A high frequencypower amplifier module comprising: an input terminal adapted to besupplied with a signal to be amplified; an output terminal; a controlterminal; a mode switching terminal; a semiconductor element including:a source; a drain for outputting a signal to be transmitted to saidoutput terminal; a first gate being disposed closer to said drain; and asecond gate disposed closer to said source and adapted to be suppliedwith the signal from said input terminal; and a control circuit forreceiving a signal from said control terminal and a signal from saidmode switching terminal to supply a bias voltage to said first gate andsaid second gate.
 14. A high frequency power amplifier module accordingto claim 13, wherein in response to the signal from said mode switchingterminal, said control circuit generates the bias voltage so that saidsemiconductor element may act in a linear region or in a non-linearaction region.
 15. A high frequency power amplifier module according toclaim 14, wherein said semiconductor element is a dual gate FET.
 16. Awireless communication system comprising: an antenna; and a highfrequency power amplifier module for supplying its output to saidantenna, wherein said high frequency power amplifier module includes: aninput terminal adapted to be supplied with a signal to be amplified; anoutput terminal; a control terminal; a mode switching terminal; asemiconductor element including: a source; a drain for outputting asignal to be transmitted to said output terminal; a first gate beingdisposed closer to said drain; and a second gate disposed closer to saidsource and adapted to be supplied with the signal from said inputterminal; and a control circuit for receiving a signal from said controlterminal and a signal from said mode switching terminal to supply a biasvoltage to said first gate and said second gate.
 17. A wirelesscommunication system according to claim 16, wherein in response to thesignal from said mode switching terminal, said control circuit generatesthe bias voltage so that said semiconductor element may act in a linearaction region or in a non-linear action region.
 18. A wirelesscommunication system according to claim 17, wherein said semiconductorelement is a dual gate FET.
 19. A high frequency power amplifier modulecomprising: an input terminal for receiving a high frequency signal tobe amplified; an output terminal; a control terminal for receiving apower control signal, a mode switching terminal for receiving a modesignal; a first semiconductor amplification element including a firstgate and a second gate between a drain and a source, said first gatebeing closer to said drain for receiving the power control signal fromsaid control terminal, and said second gate being closer to said sourcefor receiving the high frequency signal from said input terminal; and acontrolled bias circuit, responsive to the power control signal at thecontrol terminal and responsive to the mode signal at the mode switchingterminal, including a semiconductor element coupled with the firstsemiconductor amplification element and a mode switching element,wherein the mode switching element of the controlled bias circuit is ina low conductive state in response to a first level of the mode signalso that the semiconductor element is maintained at a relative high biasconditiona and the first semiconductor amplification element ismaintained at a relative low bias condition related to the power controlsignal at the control terminal, and wherein the mode switching elementof the controlled bias circuit is in a high conductive state in responseto a second level of the mode signal so that the semiconductor elementis maintained at a relative low bias condition and the firstsemiconductor amplification element is maintained at a relative highbias condition related to the power control signal at the controlterminal.
 20. A high frequency power amplifier module according to claim19, wherein the controlled bias circuit further includes a firstresistor, a second resistor, a third resistor, a fourth resistor, and afifth resistor, wherein the semiconductor element has a third gate and afourth gate between a drain and a source, said third gate being closerto said drain, said fourth gate being closer to said source, and whereinthe first resistor is coupled between the control terminal and the drainof the semiconductor element, the second resistor is coupled between thedrain of the semiconductor element and the fourth gate, the thirdresistor is coupled between the second gate and the drain of thesemiconductor element, the fourth resistor is coupled between the modeswitching terminal and the mode switching element, and the fifthresistor is coupled between the control terminal and the third gate. 21.A high frequency power amplifier module according to claim 20, whereinthe semiconductor element is turned off and the first semiconductoramplification element performs in a non-linear action region when theoutput signal of the mode switching circuit is a high conductive state,and wherein the semiconductor element is turned on and the firstsemiconductor amplification element performs in a linear action regionwhen the output signal of the mode switching circuit low conducivestate.
 22. A high frequency power amplifier module according to claim21, wherein said high frequency power amplifier module is an amplifiersystem for the GSM (Global System for Mobile communication) when themode switching element is in the high conducive state, and an amplifiersystem for the EDGE (Enhanced Data rates for GSM Evolution) when themode switching circuit is the low conducive state.
 23. A high frequencypower amplifier module according to claim 21, wherein the firstsemiconductor amplification element and the semiconductor element areduel gate field effect transistors.
 24. A high frequency poweramplification module according to claim 21, further including one ormore cascade-coupled second semiconductor amplification elements,wherein said second semiconductor amplification elements are arrangedbetween said first semiconductor amplification element and an outputcircuit.